Description
This CiT Thermal Compound was designed to make heat dissipation more efficient. To prevent overheating of your CPU or RAM, apply some Thermal Compound on your heatsinks.
Application Method
- Before applying the thermal compound please make sure the top surface of the CPU die or heat spreader is perfectly clean. If the die has any residue of old thermal compound, first clean off with isopropyl
- Place a small amount of the Thermal Compound on the surface of the die and carefully spread evenly using the spreader card included. A thin film is ideal. Extra thermal compound will not improve performance.
- Now you are ready to install your CPU cooler.
Key Features
- Silicone Technology Evolution
- Outstanding Thermal Performance
- Electrically Non-Conductive
- Low-bleed Under High Pressure
- 1.5g supplied
- Comes with spreader card for easy application
