DeepCool Z3 High-Performance Thermal Compound - 6.5 g Syringe, Silver-Grey

Description

DeepCool Z3 High-Performance Thermal Compound - 6.5 g Syringe, Silver-Grey

The DeepCool Z3 thermal paste delivers professional-grade heat transfer for CPUs and GPUs. Formulated with high-conductivity filler and a stable gel matrix, it ensures rapid dissipation of thermal energy from your processor to its heatsink or cooler. Designed for wholesale and system integrators, the 6.5 g syringe provides ample volume for multiple builds.

✅ Key Features:

  • Excellent thermal conductivity: >1.134 W/m·K for efficient heat transfer
  • Low thermal impedance: 0.201 °C·in²/W minimises temperature gradient
  • High compatibility with polished and textured CPU coolers
  • Pure electrical insulation prevents short circuits and component damage
  • Operating range: -50 °C to 220 °C for stable performance under load
  • Silver-grey, non-curing formula stays consistent over time
  • Viscosity: 73 cP for easy application and smooth spreading
  • Dielectric constant: 5.1 for reliable electrical isolation

✅ Technical Specifications:

  • Package: 6.5 g syringe
  • Thermal conductivity: >1.134 W/m·K
  • Thermal impedance: 0.201 °C·in²/W
  • Operating temperature: -50 °C to 220 °C
  • Density & compatibility: Optimised for most CPU coolers
  • Dielectric constant: 5.1
  • Viscosity: 73 cP

✅ Ideal For Trade & Wholesale:

  • System integrators and PC OEMs requiring bulk thermal solution
  • Enthusiast builders and repair workshops
  • Corporate and educational IT departments
  • Server farms and high-performance computing applications

DeepCool Z3 High-Performance Thermal Compound - 6.5 g Syringe, Silver-Grey

Product form

DeepCool Z3 High-Performance Thermal Compound - 6.5 g Syringe, Silver-Grey The DeepCool Z3 thermal paste delivers professional-grade heat transfer for... Read more

10 in stock

£2.60 Excl. VAT

    Description

    DeepCool Z3 High-Performance Thermal Compound - 6.5 g Syringe, Silver-Grey

    The DeepCool Z3 thermal paste delivers professional-grade heat transfer for CPUs and GPUs. Formulated with high-conductivity filler and a stable gel matrix, it ensures rapid dissipation of thermal energy from your processor to its heatsink or cooler. Designed for wholesale and system integrators, the 6.5 g syringe provides ample volume for multiple builds.

    ✅ Key Features:

    • Excellent thermal conductivity: >1.134 W/m·K for efficient heat transfer
    • Low thermal impedance: 0.201 °C·in²/W minimises temperature gradient
    • High compatibility with polished and textured CPU coolers
    • Pure electrical insulation prevents short circuits and component damage
    • Operating range: -50 °C to 220 °C for stable performance under load
    • Silver-grey, non-curing formula stays consistent over time
    • Viscosity: 73 cP for easy application and smooth spreading
    • Dielectric constant: 5.1 for reliable electrical isolation

    ✅ Technical Specifications:

    • Package: 6.5 g syringe
    • Thermal conductivity: >1.134 W/m·K
    • Thermal impedance: 0.201 °C·in²/W
    • Operating temperature: -50 °C to 220 °C
    • Density & compatibility: Optimised for most CPU coolers
    • Dielectric constant: 5.1
    • Viscosity: 73 cP

    ✅ Ideal For Trade & Wholesale:

    • System integrators and PC OEMs requiring bulk thermal solution
    • Enthusiast builders and repair workshops
    • Corporate and educational IT departments
    • Server farms and high-performance computing applications

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